| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which has a high dielectric constant at a high frequency range, good resin fluidity and enables a high frequency semiconductor device to be thin and to provide a semiconductor device. SOLUTION: This epoxy resin composition contains as an essential component (A) an epoxy resin, (B) a curing agent, (C) a ceramic powder and (D) a curing accelerator. The ceramic powder has a dielectric constant of 50-30,000 and occupies 30-90 vol.% in the entire epoxy resin composition. A semiconductor device sealed with the cured product is also provided.
|
