| 摘要 |
PURPOSE: A dual die package is provided to perform stably a semiconductor package process by inserting an adhesive layer between opposite side rails of the first and the second lead frames. CONSTITUTION: The first semiconductor chip(10) has the first electrode pad formed on an active region. The first lead frame(20) has the first leads adhered on the active region of the first semiconductor chip(10). The first lead includes the first contact portion located on the active region, the first connection portion, and a connection pad(27). The first binding wire is used for connecting the first electrode pad with the first contact portion. The second semiconductor chip(30) has the second electrode pad(32). The second lead frame(40) has the second leads(41) adhered on the active region of the second semiconductor chip(30). The second lead(41) includes the second contact portion(43) located on the active region and the second connection portion(45) adjacent to the first connection portion. The second bonding wire(64) is used for connecting the second electrode pad(32) with the second contact portion(43). The third bonding wire(66) is used for connecting the connection pad(27) of the first connection portion with the second connection portion(45). A package body is used for encapsulating the first semiconductor chip(10), the second semiconductor chip(30), the first bonding wire, the second and the third bonding wires(64,66), the first connection portion, and the second connection portion(45). |
