| 摘要 |
A position detecting method and a position detecting device which make it possible to detect with high accuracy by an image processing method the relative positions of two objects spaced apart in the optical axis direction of a detection optical system, and a semiconductor device manufacturing method using the position detecting method and the position detecting device. In detecting the relative positions of a first object (e.g., a mask) and a second object (e.g., a wafer), there is provided a third object equipped with separate reference alignment marks, and optical images of the reference alignment marks on the third object and optical images of the position detecting marks on the first and second objects are detected by an image pickup device, thereby detecting positional deviation between the first and second objects.
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