摘要 |
An integrated circuit device comprising a semiconductor connection component attached to a semiconductor die with an electrically conductive adhesive material. The integrated circuit device is structured with a semiconductor connection component having a first portion horizontally offset from a second portion, the first portion of the semiconductor connection component carrying the adhesive material. The semiconductor connection component may be a lead frame element having a lead finger. The semiconductor connection component with the electrically conductive adhesive material attached to the first portion thereof is a terminal such as a bond pad on a surface of a semiconductor die. The electrically conductive adhesive material is precisely applied in a simple manner, little adhesive material is wasted, and a one-step electrical/mechanical connection to bond pads of the die is provided.
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