发明名称 |
Method and apparatus for forming solder bumps |
摘要 |
The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 mum per inch of die length.
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申请公布号 |
US6527158(B1) |
申请公布日期 |
2003.03.04 |
申请号 |
US20000537228 |
申请日期 |
2000.03.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROUILLETTE GUY PAUL;GRUBER PETER ALFRED;MAURER FREDERIC |
分类号 |
B23K3/06;H01L21/60;H05K3/34;(IPC1-7):B23K20/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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