发明名称 Integrated cooling system
摘要 Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.
申请公布号 US6529377(B1) 申请公布日期 2003.03.04
申请号 US20010946798 申请日期 2001.09.05
申请人 MICROELECTRONIC & COMPUTER TECHNOLOGY CORPORATION 发明人 NELSON RICHARD D.;SOMADDER ANJAN
分类号 A61K31/00;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 A61K31/00
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