| 摘要 |
A method for manufacturing a semiconductor device is disclosed. In a method for forming a contact plug according to a high integration of a semiconductor device, the method for manufacturing a semiconductor device leaves a low dielectric insulating film as a release film in a bit line contact and a storage electrode contact region of an upper semiconductor substrate where a MOSFET is provided, forms a contact plug which buries a spacing between the bit line contact and the storage electrode contact region, forms a contact plug without damaging a lower layer by removing the release layer, and solves a misalignment problem that occurs during a photolithography process and solves a problem in obtaining a contact area by a slope etching profile that occurs during the etching process, thereby providing an improved process margin.
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