| 摘要 |
A method of manufacturing an electronic component with an insulating coating that is electrically conductive when heated adhered to a bottom surface of a semiconductor device with an external wiring ball grid array so that a top portion of the ball grid array is exposed, the method including locating the ball grid array on a wiring conductor on a circuit substrate and anodically bonding the insulating coating to the wiring conductor so that the ball grid array and the wiring conductor are electrically connected to each other. |
