发明名称 |
Pad retrieval apparatus for chemical mechanical planarization |
摘要 |
A system provides a polishing pad to a polishing head for chemical mechanical planarization of an object which is larger in diameter than the polishing pad. The system comprises a polishing head and a plurality of magazines disposed in a first region. Each magazine houses at least one removable puck for holding a polishing pad. At least one of the magazines is configured to feed the pucks from a bottom thereof to be retrieved by the transfer apparatus. The puck is configured be removably coupled to a coupling on the polishing head and to be disposed between the polishing pad and the polishing head. A transfer apparatus is provided for transferring the pucks from the magazines in the first region to a pickup stand in a second region. The polishing head is movable to the second region to pick up the pucks from the pickup stand.
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申请公布号 |
US6527621(B1) |
申请公布日期 |
2003.03.04 |
申请号 |
US20000693152 |
申请日期 |
2000.10.20 |
申请人 |
STRASBAUGH |
发明人 |
HALLEY DAVID G. |
分类号 |
B24B41/06;B24D9/08;B24D13/14;(IPC1-7):B24B49/00 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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