发明名称 |
Metal patterned structure for SiN surface adhesion enhancement |
摘要 |
A method of improving adhesion of a surface including the following steps. A structure having an upper surface is provided. A composite anchor layer is formed over the upper surface of the structure. The composite anchor layer including at least an upper anchor sub-layer and a lower anchor sub-layer. The upper anchor sub-layer is patterned to form a dense pattern of upper sub-anchors. The lower anchor sub-layer is then patterned using the upper sub-anchors as masks to form lower sub-anchors. The respective upper sub-anchors and lower sub-anchors form a dense pattern of anchors whereby the dense pattern of anchors over the upper surface improve the adhesion of the surface.
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申请公布号 |
US6528417(B1) |
申请公布日期 |
2003.03.04 |
申请号 |
US20010953613 |
申请日期 |
2001.09.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
WANG CHUNG-YU;HUANG CHENDER;TSAO PEI-HAW;CHEN KEN |
分类号 |
H01L21/44;H01L21/56;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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