发明名称 Metal patterned structure for SiN surface adhesion enhancement
摘要 A method of improving adhesion of a surface including the following steps. A structure having an upper surface is provided. A composite anchor layer is formed over the upper surface of the structure. The composite anchor layer including at least an upper anchor sub-layer and a lower anchor sub-layer. The upper anchor sub-layer is patterned to form a dense pattern of upper sub-anchors. The lower anchor sub-layer is then patterned using the upper sub-anchors as masks to form lower sub-anchors. The respective upper sub-anchors and lower sub-anchors form a dense pattern of anchors whereby the dense pattern of anchors over the upper surface improve the adhesion of the surface.
申请公布号 US6528417(B1) 申请公布日期 2003.03.04
申请号 US20010953613 申请日期 2001.09.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 WANG CHUNG-YU;HUANG CHENDER;TSAO PEI-HAW;CHEN KEN
分类号 H01L21/44;H01L21/56;H01L23/485;(IPC1-7):H01L21/44 主分类号 H01L21/44
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