发明名称 |
Land grid array stiffener use with flexible chip carriers |
摘要 |
A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured. |
申请公布号 |
US6528892(B2) |
申请公布日期 |
2003.03.04 |
申请号 |
US20010874196 |
申请日期 |
2001.06.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CALETKA DAVID VINCENT;DARBHA KRISHNA NMN;INFANTOLINO WILLIAM NMN;JOHNSON ERIC ARTHUR |
分类号 |
H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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