发明名称 |
Dicing configuration for separating a semiconductor component from a semiconductor wafer |
摘要 |
The dicing configuration for separating a semiconductor component from a semiconductor wafer is formed with a rupture joint which is created together with connecting holes that interconnect metallization planes, in a transition area between a scribe line and the semiconductor component. The rupture joint is an additional recess with which the insulating layer is made thinner. |
申请公布号 |
US6528392(B2) |
申请公布日期 |
2003.03.04 |
申请号 |
US20000745541 |
申请日期 |
2000.12.21 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FEURLE ROBERT;SAVIGNAC DOMINIQUE |
分类号 |
H01L21/301;H01L23/31;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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