| 摘要 |
The present invention includes circuits, methods of adhering an integrated circuit device to a substrate, and methods of forming a circuit. According to one aspect of the present invention, a method of forming a circuit includes: providing an integrated circuit device having an outer surface and a plurality of conductive bumps upon the outer surface; providing a substrate having a plurality of bond pads which correspond to respective ones of the conductive bumps; providing an electrically insulative adhesive over at least a portion of the outer surface of the integrated circuit device; and coupling the integrated circuit device and the substrate following the providing the adhesive, the coupling connecting the outer surface of the integrated circuit device with the substrate and forming a plurality of electrical interconnections comprising the conductive bumps and the bond pads. |
