APPARATUS PROCESSING A GATE PORTION IN A SEMICONDUCTOR MANUFACTURING APPARATUS, WHICH REMOVE A GATE CORRESPONDENCE PORTION FROM A SEMICONDUCTOR PACKAGE CONNECTED TO A LEAD FRAME, AND A RESIN BURR DEPOSITED ON A LEAD PORTION ASSOCIATED WITH THE SEMICONDUCTOR PACKAGE

摘要

An apparatus processing a gate portion in a semiconductor manufacturing apparatus includes a laser beam scanner unit and a cutter. The laser beam scanner unit is disposed along a carrying line on which a lead frame is carried. The laser beam scanner unit has an optical scanner unit second-dimensionally scanning laser beams, and a lens unit collecting the laser beams. The cutter has a punch. The punch mechanically pushes to cut a gate correspondence portion which is perfectly cut away or almost cut away from a semiconductor package body by the laser beams.