发明名称 |
Multi-layer circuit board and method of manufacturing same |
摘要 |
An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.
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申请公布号 |
US6528733(B2) |
申请公布日期 |
2003.03.04 |
申请号 |
US20010902800 |
申请日期 |
2001.07.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKENAKA TOSHIAKI;NISHII TOSHIHIRO;YAMANE SHIGERU;NAKAMURA SHINJI;KOMODA HIDEAKI;KISHIMOTO KUNIO |
分类号 |
C08J5/24;H05K1/03;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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