| 摘要 |
PURPOSE: A heating apparatus for sputtering system for heating a substrate of chamber to a certain temperature to coat a uniformed thin film or annealing the substrate of chamber to remove stress is provided. CONSTITUTION: In a sputtering system(10) comprising a chamber body(14) for forming chamber(12) for coating a thin film, the heating apparatus for the sputtering system comprises a heater(22) which is installed at the chamber, and which is equipped with a tube heater(24) and two terminals(26a,26b) that are mounted on both ends of the tube heater(24); first flange(50) which is close adhesively attached to the inner surface the chamber body, and into which the two terminals of the heater are penetrated; second flange(60) which is close adhesively attached to the outer surface the chamber body, and into which the two terminals of the heater are penetrated; a fixing means(70) for separately fixing the first and second flanges(50,60); and a seal(80) that is interposed between the chamber body(14) and first flange(50) to maintain air tightness, wherein a cooling water passageway(56) is additionally formed at the first flange adjacently to the seal, the heating apparatus further comprises a heating plate(30), first reflection plate(32), a radiation plate(34), second reflection plate(36), and a temperature sensor(100).
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