发明名称 SUBSTRATE FOR MOUNTING ELECTRONIC PART
摘要 PURPOSE: To provide a substrate for mounting electronic parts, where dimension stability by moisture absorption and heating is improved. CONSTITUTION: The substrate for mounting electronic parts 10 is provided with an insulating base material 11 and a wiring pattern 12 having a terminal part which is formed on one surface of the insulating base material 11 and which is connected to an outer part. A metallic pattern 16 independent of the wiring pattern 12 is arranged at least near the terminal part.
申请公布号 KR20030017392(A) 申请公布日期 2003.03.03
申请号 KR20020049676 申请日期 2002.08.22
申请人 MITSUI KINZOKU KOGYO KABUSHIKI KAISHA 发明人 IGUCHI YUTAKA;ISHISAKA MASAHARU
分类号 H05K1/02;H01L21/60;H05K1/09;H05K1/11;(IPC1-7):H05K1/11 主分类号 H05K1/02
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