发明名称 |
SUBSTRATE FOR MOUNTING ELECTRONIC PART |
摘要 |
PURPOSE: To provide a substrate for mounting electronic parts, where dimension stability by moisture absorption and heating is improved. CONSTITUTION: The substrate for mounting electronic parts 10 is provided with an insulating base material 11 and a wiring pattern 12 having a terminal part which is formed on one surface of the insulating base material 11 and which is connected to an outer part. A metallic pattern 16 independent of the wiring pattern 12 is arranged at least near the terminal part.
|
申请公布号 |
KR20030017392(A) |
申请公布日期 |
2003.03.03 |
申请号 |
KR20020049676 |
申请日期 |
2002.08.22 |
申请人 |
MITSUI KINZOKU KOGYO KABUSHIKI KAISHA |
发明人 |
IGUCHI YUTAKA;ISHISAKA MASAHARU |
分类号 |
H05K1/02;H01L21/60;H05K1/09;H05K1/11;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|