发明名称 |
SEMICONDUCTOR FABRICATION APPARATUS INCLUDING HEATER HAVING THE SAME AS SHAPE OF WAFER |
摘要 |
PURPOSE: A semiconductor fabrication apparatus including a heater having the same as a shape of a wafer is provided to prevent the abnormal formation of a layer on a flat part of a wafer by removing a part of a heater corresponding to the flat part of the wafer loaded on the heater. CONSTITUTION: A wafer as a processing target is loaded on a heater. A ceramic purge ring is used for supply uniformly a reaction gas to a lower face of the wafer loaded on the heater. The heater has the same as a shape of the wafer. The wafer has a flat part. A part of the heater corresponding to the flat part of the wafer is removed. Accordingly, the flow of the reaction gas and a non-reaction gas discharged from the heater is constantly maintained by removing the corresponding part of the heater corresponding to the flat part of the wafer loaded on the heater.
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申请公布号 |
KR20030016907(A) |
申请公布日期 |
2003.03.03 |
申请号 |
KR20010050986 |
申请日期 |
2001.08.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HYEONG GI |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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地址 |
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