发明名称 SEMICONDUCTOR FABRICATION APPARATUS INCLUDING HEATER HAVING THE SAME AS SHAPE OF WAFER
摘要 PURPOSE: A semiconductor fabrication apparatus including a heater having the same as a shape of a wafer is provided to prevent the abnormal formation of a layer on a flat part of a wafer by removing a part of a heater corresponding to the flat part of the wafer loaded on the heater. CONSTITUTION: A wafer as a processing target is loaded on a heater. A ceramic purge ring is used for supply uniformly a reaction gas to a lower face of the wafer loaded on the heater. The heater has the same as a shape of the wafer. The wafer has a flat part. A part of the heater corresponding to the flat part of the wafer is removed. Accordingly, the flow of the reaction gas and a non-reaction gas discharged from the heater is constantly maintained by removing the corresponding part of the heater corresponding to the flat part of the wafer loaded on the heater.
申请公布号 KR20030016907(A) 申请公布日期 2003.03.03
申请号 KR20010050986 申请日期 2001.08.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HYEONG GI
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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