JIG WAFER AND METHOD OF ADJUSTING POSITION OF SHADOW RING TO WAFER WITH USING THE SAME IN OPERATING SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

摘要

PURPOSE: A jig wafer and a method of adjusting the position of a shadow ring to a wafer with using the same in operating semiconductor device manufacturing apparatus are provided to prevent the generation of an etch processing error by handling and setting up the position of a shadow ring on an edge part of a semiconductor wafer. CONSTITUTION: A jig wafer(100) is composed of a metal material of stainless steel in order to prevent deformation due to electricity and temperature. A mark is formed on a surface of an edge portion of the jig wafer(100). The mark is formed with a plurality of scales(101) in order to perform numerical control. An interval between scales is about 0.2mm. The scales(101) are used for providing a relative position of the shadow ring for clamping an edge portion of the semiconductor wafer. A sliding prevention hole(105) is formed at the center portion of the jig wafer(100).