发明名称 |
IN-LINE SPUTTERING SYSTEM |
摘要 |
PURPOSE: An in-line sputtering system is provided to improve productivity and quality of a thin film by obtaining a continuous and stabilized substrate flow. CONSTITUTION: An entry loadlock machine(100) has an entry loadlock chamber(102). A buffer heating machine(200) has a buffer heating chamber(202). An entry transfer machine has an entry transfer chamber(302). The first sputtering machine(400) has the first coating chamber(402). A heating machine(500) has a heating chamber(502). The second sputtering machine(600) has the second coating chamber(602). A firing machine(700) has a firing chamber(702). A discharge transfer machine(800) has a discharge transfer chamber(802). A buffer cooling machine(900) has a buffer cooling chamber(902). A discharge loadlock machine(1000) has a discharge loadlock chamber(1002). The machines(100-1000) and the chambers(102-1002) are connected to each other by an in-line method.
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申请公布号 |
KR20030016546(A) |
申请公布日期 |
2003.03.03 |
申请号 |
KR20010050179 |
申请日期 |
2001.08.21 |
申请人 |
SAMSUNG CORNING CO., LTD. |
发明人 |
SONG, HUI SU |
分类号 |
H01L21/203;(IPC1-7):H01L21/203 |
主分类号 |
H01L21/203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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