| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, having a fine through-hole and a conductor member arranged in the through-hole. SOLUTION: The manufacturing method of the wiring board, having the through-hole and the conductive member arranged in the through-hole is provided with a step for forming a first conductive film on a first substrate, a step for forming a first resist film on the first film, a step for forming the through-hole from the surface of a second substrate toward the rear face, a step for bonding the second substrate and the first substrate, so that the surface of the second substrate is confronted with a face where the first resist film in the first substrate is arranged, a step for removing the first resist film existing in the base of the through-hole and a step for forming the conductive member in a through part by electrocasting with the first conductive film existing in the base of the through-hole as an electrode.
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