| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem locking compatibility as a result of the positions of wiring electrodes on the surface of a wiring board having to be changed, corresponding to the size of a semiconductor element, when the sizes of semiconductor chips, etc., is changed. SOLUTION: Since a plurality of wiring electrodes 13 are formed at a wiring pattern 12, on the surface of the wiring board 11 and independently of the other wiring patterns 12, the wiring board 11 can be shared by the plurality of semiconductor chips, by connecting metal thin line to the wiring electrode 13 selected properly from among the plurality of wiring electrodes 13 though the sizes of the semiconductor chips to be mounted on the wiring board 11 are changed.</p> |
