| 摘要 |
PROBLEM TO BE SOLVED: To reduce heat damages to a semiconductor package and peripheral components and to improve connection reliability. SOLUTION: Solder balls 8 are loaded on multiple lands 6, arranged on a circuit board 3 via the solder paste 7 of a low-melting point. Preliminary heating is performed, solder paste 7 is melted and caked, and the semiconductor package 2 is positioned and loaded in a state with the balls 8 being fixed to the circuit board 3. Reflow soldering is performed, the solder balls 8 are melted and caked, and the semiconductor package 2 is mounted on the circuit board 3.
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