| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component-packaging structure and an electronic component-packaging method that secure reliability at a junction section after packaging, and at the same time can obtain sufficient reinforcement effect. SOLUTION: In the electronic component-packaging structure where a bump 4 of an electronic component 3 is joined to an electrode 2 on a substrate 1, there are provided a first resin section 5A formed on the lower surface of the electronic component 3 by covering a periphery at a root section of the bump 4, and a second resin section 5B formed on the upper surface of the substrate 1 by covering the junction section between the bump 4 and electrode 2. The first resin section 5A is interlocked mutually for forming a continuous resin film 5C at the first resin section 5A of the adjacent bump 4 and on the lower surface of the electronic component 3, and a gap section 6 where the resin does not exist at the lower section of the continuous resin film 5C is formed, thus reinforcing the root section of the bump 4 effectively, securing degassing in reflow, and hence obtaining sufficient reinforcement effect while securing reliability at a junction section after packaging.</p> |
