发明名称 HEAT CONDUCTIVE SHEET
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat conductive sheet of superior conductivity in a sheet thickness direction and of high productivity, which is simple to manufacture at a low cost. SOLUTION: In an organic matrix material, boron nitride powder which contains secondary cohesion body particle, whole diameter is 50μm or more, by 1-20 wt.% as a heat conductive filler is dispersed and mixed. It is desirable that the organic matrix materials be silicone rubber.</p>
申请公布号 JP2003060134(A) 申请公布日期 2003.02.28
申请号 JP20010247843 申请日期 2001.08.17
申请人 POLYMATECH CO LTD 发明人 ISHIHARA NATSUKO
分类号 H01L23/36;H01L23/15;H01L23/373;(IPC1-7):H01L23/36 主分类号 H01L23/36
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