| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board, having high heat dissipation properties which can improve productivity of processing of a through-hole and carry out hole processing at a low cost. SOLUTION: A heat-conducting resin composition, which consists of inorganic filler of 70 to 95% by mass and a resin composition of 5 to 30% by mass, comprising at least liquid-like thermosetting resin, thermoplastic resin powder and potential curing agent, is brought into contact with a metal foil, is heated and pressurized at a temperature lower than the temperature, whereat the heat-setting resin starts irreversibly setting for improving viscosity of the heat- conducting resin composition and solidifying it, and thereafter a through-hole is formed and heat setting resin is set for forming an insulation board, and formation of a through-hole and formation of a circuit pattern are carried out. Furthermore, it is preferable that the heat conducting resin composition be integrated with a reinforcing material. |
