发明名称 METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING CIRCUIT BOARD AND CERAMIC MULTILAYERED SUBSTRATE BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a pattern by which a photosensitive paste in a region where the paste should be removed by developing can be surely removed to form a desired pattern when patterning is carried out by a photolithographic method and to provide a method for manufacturing a circuit board and a ceramic multilayered board by using the above method. SOLUTION: After a base layer 2 is formed by applying a composition A for the base layer which can be developed with a developer of a photosensitive paste layer 3 on a supporting body (alumina insulating substrate) 1, a photosensitive paste B containing inorganic powder and a photosensitive organic component is applied on the base layer 2 to form the photosensitive paste layer 3. After at least the photosensitive paste layer 3 is exposed, the photosensitive paste layer 3 and the base layer 2 are developed to form a pattern (unbaked pattern) 6.
申请公布号 JP2003057829(A) 申请公布日期 2003.02.28
申请号 JP20010242086 申请日期 2001.08.09
申请人 MURATA MFG CO LTD 发明人 KUBOTA MASAHIRO
分类号 G03F7/11;G03F7/004;H05K3/12 主分类号 G03F7/11
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