| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding strength with respect to a circuit board in a mounted electronic circuit component. SOLUTION: A dummy conductive pad 6, bonded to the board, is arranged in the center of the mounting face of the electronic circuit component 1, and the dummy conductive pad 6 is bonded on the circuit board by reflow soldering in a same way as terminal pads 4. Thus, the electronic circuit component 1 is held mechanically, by the circuit board with the bonding of the terminal pads 4 at the peripheral edge, and the component is held by the dummy conductive pad 6 even if it is located at the center. Holding strength is increased as a whole, shock resistance improves and the peeling of the electronic circuit component 1 from the circuit board is suppressed.
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