发明名称 MULTISTAGE DISCHARGE PLASMA TREATMENT METHOD AND APPARATUS THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a metal oxide thin film or a metal nitride thin film by discharge plasma treatment which enables to form a high-quality metal oxide thin film or metal nitride thin film at such a film formation speed as to satisfy the industrial requirements. SOLUTION: In a multistage discharge plasma treatment method and apparatus for forming a thin film consisting of a metal oxide chemical compound and/or a metal nitride chemical compound by reacting a gas containing metal elements and a gas containing oxygen and/or a gas containing nitrogen, a gas containing metal elements which has passed through one plasma generation chamber is joined by a gas containing oxygen and/or a gas containing nitrogen, and then is passed through another plasma generation chamber to form a thin film.
申请公布号 JP2003059924(A) 申请公布日期 2003.02.28
申请号 JP20010248039 申请日期 2001.08.17
申请人 SEKISUI CHEM CO LTD 发明人 EGUCHI YUJI;YUASA MOTOKAZU
分类号 H05H1/24;B01J19/08;C23C16/509;H01L21/31;H01L21/316 主分类号 H05H1/24
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