发明名称 |
MULTISTAGE DISCHARGE PLASMA TREATMENT METHOD AND APPARATUS THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a metal oxide thin film or a metal nitride thin film by discharge plasma treatment which enables to form a high-quality metal oxide thin film or metal nitride thin film at such a film formation speed as to satisfy the industrial requirements. SOLUTION: In a multistage discharge plasma treatment method and apparatus for forming a thin film consisting of a metal oxide chemical compound and/or a metal nitride chemical compound by reacting a gas containing metal elements and a gas containing oxygen and/or a gas containing nitrogen, a gas containing metal elements which has passed through one plasma generation chamber is joined by a gas containing oxygen and/or a gas containing nitrogen, and then is passed through another plasma generation chamber to form a thin film. |
申请公布号 |
JP2003059924(A) |
申请公布日期 |
2003.02.28 |
申请号 |
JP20010248039 |
申请日期 |
2001.08.17 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
EGUCHI YUJI;YUASA MOTOKAZU |
分类号 |
H05H1/24;B01J19/08;C23C16/509;H01L21/31;H01L21/316 |
主分类号 |
H05H1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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