SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a defective bit detected during a package process or after package process can be relieved and whole yield can be improved, in a multi-chip module. SOLUTION: A replacement information storing section 10 records additional replacement information decided in accordance with a test performed during an assembly process or after the process. Replacement information additional load sections 103 and 203 receive additional replacement information from the outside of memory chips 100 and 200. Replacement data holding section 104 and 204 store address information corresponding to a defective memory cell detected in a manufacturing process of a memory chip, and can change address information outputted in accordance with additional replacement information externally given.