| 摘要 |
PROBLEM TO BE SOLVED: To prevent connection fails in an electronic component by accurately controlling the amount of stretch in the electronic component to be subjected to thermocompression bonding on a substrate. SOLUTION: The electronic component crimping apparatus is equipped with a crimp head unit (44) for allowing an electronic component to be subjected to thermocompression bonding to a substrate, a press unit (48), a pressure control unit (83) for controlling pressure force, a hating unit (43) for heating the crimp head unit (44), a temperature control unit (85), and a thermocompression bonding control unit (80) for controlling the pressure control unit (83) and heating unit (43) based on thermocompression bonding condition data where at least one of the pressure force and a heating temperature is set variably during one process from the start of thermocompression bonding operation in the electronic component to the end. In this case, the thermocompression bonding condition data are set to first pressure force in a first stage in one process of thermocompression bonding operation, and are set to second pressure force lower than the first one in a second stage following the first one. |
