| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is superior in mechanical strength, heat resistance, adhesion strength, durability and dimensional stability, and has high insulation reliability, even if an insulation layer is thinned and enables high density of a wiring. SOLUTION: A both-sided wiring board B1 with a capacitor is manufactured by laminating an aramid film 20 and copper foils 22, 22 adhered to both sides thereof by means of epoxy adhesive prepreg sheets 21, 21. A two-sided wiring board B2 having an inductor is manufactured by laminating an aramid film 30 and copper foils 31, 32 adhered to both sides thereof by means of epoxy adhesive prepreg sheets 31, 31. After the two-sided wiring boards B1, B2 are laminated with a glass cloth prepreg between, copper foils 52, 52 are laminated in both sides thereof, and a multilayer printed wiring board 4 of 8 layers, which has a copper foil wherein a circuit is formed, each copper foil being connected by a through-hole, is manufactured.</p> |
