| 摘要 |
PROBLEM TO BE SOLVED: To realize a multiple pin package or miniaturize a package mounting a high-speed LSI. SOLUTION: A relay substrate 7 is provided surrounding a semiconductor chip 1 shielded in the package. The relay substrate 7 consists of an insulating film made of polyimide resin, etc., and fine wirings 8 (8a, 8b and 8c) are formed on its one face. The respectively one ends of these wirings 8 are connected electrically with the bonding pad 5 of the semiconductor chip 1 via a wire 9. The other ends of the wirings 8 are connected electrically with leads (4a, 4b, 4c), arranged outside of the relay substrate 7 via a wire 10. Concerning the wirings 8a on the relay substrate 7, mutually adjacent four wirings 8a are made to be single and common at one end of the relay substrate 7 to be connected electrically with a Vss wiring 4a via the wire 10. |
