SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE CHIP AND PRODUCTION METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To miniaturize a package size by reducing an area for wire-bonding a hollow package and a semiconductor device chip. SOLUTION: A solid-state imaging device chip 40 has flange parts 44 expaded on both left and right sides on the upper face of the chip, and an electrode terminal 42 is provided on this flange part 44. In the case of packaging the solid-state imaging device chip 40 in a hollow package 30, when the lower face part of the solid-state imaging device chip 40 is housed in a chip housing part 31 of the hollow package 30, the top end of the flange part 44 of the solid- state imaging device chip 40 is located to be partially covered on the upper face of a step part 34 equipped with an internal electrode terminal 33 of the hollow package 30. By wire-bonding the electrode terminal 42 and the internal electrode terminal 33 in such a state, the solid-state imaging device chip 40 and a lead frame 32 are connected.