| 摘要 |
PROBLEM TO BE SOLVED: To improve an electronic part which is equipped with lead terminals 2 and manufactured, using a lead frame 10 in function and degree of freedom of design, and to provide the lead frame 10 suitable for manufacturing the electronic part. SOLUTION: This manufacturing method comprises a first process of forming an electronic part element on an insulating board 1, a second process of enabling a first lead terminal 2a and a second lead terminal 2b to bear against board terminals 3 formed on both sides of the certain end of an insulating board 1 through the first process as kept insulated from each other at the end of the insulating board, a third process of bringing the parts which bear against each other into contact with molten solder, and a fourth process of cutting the first terminal and the second lead terminal off a support 11. The lead frame 10 is composed of the support 11, the first lead terminal 2a, and the second lead terminal 2b which are formed into one piece, and the terminals 2a and 2b are positioned so as to confront each other. |
