SOLDER SEGREGATION CONTROLLER AND COMPONENT REWORKING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce a temperature gradient generated in a solder flow process by process control and to suppress segragation. SOLUTION: A segragation controller is used for the solder flow process for soldering electronic components on the surface of a board by using the Pb free solder of a high melting point and soldering the different electronic components, by giving a solder jet from the rear face of the board. The solder segragation controller is provided with a heater 100 for heating an opposite side at the time of soldering by the solder jet and a controller 110 for controlling the heater 100 to be a prescribed temperature.