| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be brought into a mirror package after an assembling process without replacing a bonding wire. SOLUTION: Fixed external terminals 11 include an external terminal for power supply and an external terminal for grounded potential supply, and are disposed symmetrically with each other and fixed. Different kinds of variable external terminals 13 are disposed symmetrically with each other. External terminals 12 for a selection whose polarity is set reversely with each other are disposed symmetrically with each other and fixed. A signal replacement circuit 3 replaces the arrangement of the variable external terminals 13 disposed symmetrically with each other according to the settings of the external terminals 12 for the selection. |
