| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a copper-based polishing liquid, by which copper or copper alloy is hardly etched in a dipping state and is dissolved in a polishing treatment state with the etching rate which is several tens of times the rate in the dipping state. SOLUTION: This copper-based polishing liquid contains at least one organic acid, such as amino acetic acid, etc., which reacts with copper hydrate to produce complex, oxidizing agent, and water.</p> |
