| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component capable of efficiently mounting components on a substrate. SOLUTION: The apparatus for mounting the electronic component takes out the component 5 from a component supply unit 3 by a transfer head 9 and transfers and mounts the component 5 on the substrate 2. The apparatus comprises a substrate recognition camera 15 for imaging, to detect a position of the substrate 2 positioned on a conveying passage 1 by moving independently of the head 9, by advancing or retracting with respect to the substrate 2 positioned on the passage 1. The method for mounting the electronic component comprises an imaging step of imaging the substrate 2 by the camera 15, and a component taking-out step of taking out the component by the head 9 by the supply unit 3, to be executed simultaneously in parallel therewith. Thus, a tact time can be shortened, and the component 5 can be mounted efficiently on the substrate 2. |
