| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly reliable circuit board of high density by forming a conductor circuit (wiring) constructed to be embedded in an electric insulation layer readily and effectively and forming a flat electric insulation layer, which is superior in insulation property, thereon. SOLUTION: The manufacturing method of a circuit board has a process for forming a setting resin layer 2 by using a setting composition on an inner layer substrate 1, a process for forming a conductor circuit 3 on the setting resin layer 2, a process for embedding the conductor circuit 3 in the setting resin, by pressuring the conductor circuit 3 from an upper part and a process for forming the electric insulation layer 2 by setting the setting resin layer 2. The circuit board has the inner layer substrate 1, the electrical insulation layer 2 formed thereon and the conductor circuit 3 embedded and formed in the electric insulation layer 2 at almost the same height as the electrical insulation layer 2. In the circuit board, the electrical insulation layer 2 is formed of a setting composition comprising alicyclic olefin polymer and a setting agent. |
