| 摘要 |
PROBLEM TO BE SOLVED: To prevent a foreign matters from existing on a wafer or a treatment film. SOLUTION: An air supply means 11, for a development device for taking air from the outside to a wafer treatment chamber 10, has a pressure air blower 12 and a filter unit 13A. The filter unit 13A has a first chemical filter 13a for removing amine impurities, a second chemical filter 13b for removing sulfuric impurities, a temperature/humidity control system 13c and a HEPA filter 13d. In the wafer treatment chamber 10, development is carried out, by using tetramethylammonium hydroxide aqueous solution on an exposed resist film 17, to form a resist pattern. |
