| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a sealing method therefor and a mounting method using it for realizing a semiconductor package product with high reliability, by improving the strength in handling with low-cost composition. SOLUTION: A bare chip 11 has an active surface 14, provided with a plurality of ball electrodes 13 for external connection related to an internal integrated circuit. A uniform array of ball electrodes 13 is realized over the entire active surface 14 with a multilayer wiring layer 12. The surfaces of the bare chip 11 other than the active surface 14 is covered with a protective coating package, for example, a resin coating package 15. The thickness of the resin coating package 15 is severalμm to tens ofμm, and is hardly different from the size of the bare chip.
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