| 摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize a radio communication module by eliminating thermal via holes for radiating heat from a multilayer board for composing a radio communication module, composing more inductors, capacitors, and connection lines in the inner layer of the multilayer board for improving heat dissipation and packaging density. SOLUTION: Passive elements (inner-layer inductor 28, inner-layer capacitor 30, and the like) in a high-frequency circuit are incorporated in the multilayer board, a cavity 36 is provided on a back side that becomes a mounting surface to a main board 43 of the multilayer board, and a semiconductor chip 37 for composing semiconductor elements in a high-frequency circuit is subjected to flip-chip packaging in the cavity 36. Then, the cavity 36 on the back of the multilayer board is covered with a heat sink 41 made of a metal plate to seal the inner semiconductor chip 37.</p> |
