| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer circuit board of compactness, high performance and a low price, which can make a high-frequency circuit and a low-frequency circuit coexist in compactness, and has low loss and heat resistance in a high-frequency circuit board, and where a pattern is not too fine and high density mounting is possible. SOLUTION: The multilayer circuit board has a high-frequency resin board 10 where a ground conductor 11 is disposed closely in one surface and a low-frequency resin board 20, where a ground conductor 21 is disposed closely in the other surface. The high-frequency resin board 10 and the low-frequency resin board 20 are opposed at a ground conductor side. At least a part of a conductor pattern 12 formed in the high-frequency resin board 10 and a part of a conductor pattern 22 formed in the low-frequency resin board 20 are connected via a through-hole.</p> |
