| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which can surely carry out read of an alignment mark for positioning and cope with turning into high density/fining of a wiring pattern. SOLUTION: In the manufacturing method of a multilayer printed wiring board, a barrier layer 50 for preventing laser beam from proceeding is formed on a foundation layer 2, which is a work substrate W and a alignment mark 9 is formed thereon corresponding to the barrier layer 50. In exposing the alignment mark 9 covered with a build-up insulation layer 6, a laser beam is prevented from proceeding at least in a formation position of the barrier layer 50, so that there is no possibility of over-boring. The exposed alignment mark 9 is imaged by a CCD sensor, and positioning is carried out.</p> |
