发明名称 CIRCUIT BOARD DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To enhance flexibility in designing wiring structure on the side of a mother board by burying an intra-board wiring in a board to be mounted on the mother board, so as to simplify the wiring structure. SOLUTION: A circuit part is mounted on a module board 1, and these are mounted on the mother board 14 in a state of being assembled previously. Between inner layer parts 2 and 3 of the substrate 1, the intra-board wiring 9 for connecting two in-board wiring terminals 7 arranged at its end faces 1C and 1D are provided. Thus, there is no need to form the wiring pattern, etc., by-passing the board 1 at the mother board 14, thereby its wiring structure is simplified and flexibility in designing the wiring pattern, etc., is improved.</p>
申请公布号 JP2003060112(A) 申请公布日期 2003.02.28
申请号 JP20010246193 申请日期 2001.08.14
申请人 MURATA MFG CO LTD 发明人 ICHIKAWA KEIICHI;SASAHATA AKIHIRO
分类号 H05K1/16;H01L23/12;H01L25/00;H05K1/02;H05K1/11;(IPC1-7):H01L23/12 主分类号 H05K1/16
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