APPARATUS AND METHOD FOR TREATMENT OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the treatment of a substrate wherein the substrate comprising a notch can be held satisfactorily and the substrate can be treated without damaging the substrate. SOLUTION: In the substrate treatment apparatus, a wafer W is sandwiched by a spin chuck so as to be turned, a treatment liquid is supplied to the wafer W being turned, and the surface of the wafer W is treated. The spin chuck is provided with a holding pin 51 which comes into contact with the end face of the wafer W so as to sandwich the wafer W. The wafer contact face 51a of the holding pin 51 comprises a radius of curvature R determined so as not to come into contact with the inner wall of the notch N formed on the end face of the wafer W as viewed from a plane, and it is formed in a convex curved surface toward the rotation center of the spin chuck. Consequently, the wafer contact face 51a does not enter the notch N.