| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is superior in transmission efficiency and airtightness of high-frequency signals, and suppresses the influence of distortion due to stress. SOLUTION: The holding member 11 of a coaxial connector 3 is fitted to the fitting part 2a of the side part of a frame 2 through the inside/outside of the frame 2, has a through-hole 11b piercing through to the inside of the frame 2, formed so that the connector 3 is inserted and fitted from the outside of the frame 2, and is provided with a shelf part 11a having a circuit board 6 installed on its upper surface at a site under the through-hole 11b at a surface inside of the frame 2. On the surface of the circuit board 6, a line conductor 6a, connecting the end of a center conductor 3b projecting from the face inside the frame 2 and a semiconductor element 5, is formed. In addition, on a lower side, a small width part 11d where a width in the line direction of a line conductor 6a is reduced toward the inside of the frame is formed, the lower surface of the small width part 11d is connected to the main face of the upper side of a substrate 1, and a side face facing the outside of the frame 2 of the small width part 11d is connected to the inner face of the frame 2. |
