| 摘要 |
PROBLEM TO BE SOLVED: To provide a plastic film where a metal film for forming an electrode composing electronic components by transfer is formed, especially a metal film transfer film for electronic components having the metal film where conductivity after the transfer is superior. SOLUTION: In the metal film transfer film for electronic components, a mold release layer and a metal layer are formed on a plastic film in this order, and the thickness of the metal film and surface resistivity meet the relationship of an expression (1), Y<=20000/X+10 (1). In this case, X is the thickness of the metal film (angstrom), and Y is the surface resistivity (Ω/(square)).
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