| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package for high-frequency circuit, which suppresses the deterioration of cavity resonance and isolation characteristics and has superior transmission characteristics in the package consisting of a package base mounting a high-frequency semiconductor element, a package lid, arranged on the package base and an electromagnetic wave absorber arranged inside the package lid. SOLUTION: The distance between a high-frequency transmission line formed at the high frequency circuit and the package base and the electromagnetic wave absorber is set to 0.1 to 1.5 mm. |
